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microprocessing

Traducere "microprocessing" în chineză

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微处理

One reason is that innovations in display, battery and microprocessing technologies have greatly reduced their cost.

一个原因是科技革新使显示，电池和微处理技术大大减少了成本。

Since it is difficult to apply the dry etching method, which is frequently used for forming an Al alloy wire, to Cu for microprocessing, the so-called damascene process is mainly adopted for Cu, in which a Cu film is deposited on a dielectric film to which groove processing has been provided and then the Cu film is removed except in portions where the Cu film is embedded inside a groove by chemical-mechanical polishing (CMP) to form an embedded wire.

由于难以对Cu施加通常用于形成Al合金线之干式蚀刻方法进行微处理，因而主要对Cu采用所谓的大马士革（damascene）制程，其中将Cu膜沉积在已提供凹槽处理之介电膜上，且随后藉由化学机械抛光（CMP）来移除除铜膜嵌入凹槽中之部分中之Cu膜以形成嵌入式线。

The Darth Vader of microprocessing.

该达斯维达的微处理

Innovative laser microprocessing and plasma technology are essential for modern displays.

对于现代化显示器而言，创新激光微加工与等离子体技术是不可或缺的。

go-go industries such as microprocessing and laser technology.

热门投机的工业，如显微处理和激光技术

Desk top microprocessing computer.

台式微处理电脑。

These microprocessing chips.

那个哦一定是芯片的问题

(Excl. Tax) - A decorative laminated sheet. Has undergone special microprocessing for a colorful and 3D-like feel.

（不含税） - 根据设计与用途选择理想材料，追求更高品质的单色三聚氰胺装饰板

(Excl. Tax) - A decorative laminated sheet. Has undergone special microprocessing for a colorful and 3D-like feel.

（不含税） - 经过微观特殊加工，富有立体感及色泽丰富的装饰板

When a film having tensile stress equivalent to tensile stress of an upper layer of the sensor is added to a lower layer of the sensor, the tensile stress can be larger than remnant stress of a setting value of the heater, and thus deflection in the diaphragm including the sensor portion underwent a microprocessing is prevented so that a thermal fluid flow sensor having a high accuracy and small resistance fluctuation is provided.

通过在传感器下层增加具有的拉伸应力相当于上层拉伸应力的膜，能够实现加热器设计值以上的残余应力，因此能够提供一种防止发生在包括实施了精细加工的传感器部等的薄膜出现弯曲、电阻值变化小的高精度的热式流体流量传感器。

In recent years, with ever higher integration and higher performance of semiconductor integrated circuits (LSI), new microprocessing technologies have been developed.

近年来，伴随，人们已开发出具有更高积体度及更高性能之半导体积体电路（LSI）的新颖微处理技术。