Provided are a radiation-sensitive resin composition, from which a chemically amplified resist showing reduced line width roughness and ensuring the formation of a desired pattern shape at a high accuracy can be obtained, and a method for forming a resist pattern using the same.
This invention provides a novel rinsing liquid for lithography, which, for a photoresist pattern, can reduce surface defects, the so-called defects, without sacrificing the quality of the product, and, at the same time, can impart resistance to electron beam irradiation to suppress the shrinkage of the resist pattern, and a method for resist pattern formation using the same.
Disclosed are an alicyclic compound in which a cholic acid ester structure-containing group is bound to an adamantane skeleton, method for manufacturing the same, composition containing the same, and resist pattern formation method using the same, that provide an alicyclic compound which has superior solvent properties, light exposure sensitivity, resolution, roughness, and heat resistance, etc., and especially excellent dissolution inhibiting effect against development fluids, and is useful as a positive photoresist monomer or dissolution inhibitor used in semiconductor device fabrication, and that provide a method for manufacturing the same, composition containing the same, and resist pattern formation method using the same.
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