Voeg een lege signaallaag toe nabij het midden van de PCB-stackup.
Add a blank signal layer near the center of the PCB stackup.
Daarom is het het beste om de techniek van het rangschikken van sporen en PCB-stackup te gebruiken om EMI-problemen op te lossen of te verminderen, zoals hogesnelheidssignalen die door de binnenste laag gaan.
Therefore, it is best to use the technique of arranging traces and PCB stackup to solve or reduce EMI problems, such as high-speed signals going through the inner layer.
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