Since it is difficult to apply the dry etching method, which is frequently used for forming an Al alloy wire, to Cu for microprocessing, the so-called damascene process is mainly adopted for Cu, in which a Cu film is deposited on a dielectric film to which groove processing has been provided and then the Cu film is removed except in portions where the Cu film is embedded inside a groove by chemical-mechanical polishing (CMP) to form an embedded wire.
When a film having tensile stress equivalent to tensile stress of an upper layer of the sensor is added to a lower layer of the sensor, the tensile stress can be larger than remnant stress of a setting value of the heater, and thus deflection in the diaphragm including the sensor portion underwent a microprocessing is prevented so that a thermal fluid flow sensor having a high accuracy and small resistance fluctuation is provided.
In recent years, with ever higher integration and higher performance of semiconductor integrated circuits (LSI), new microprocessing technologies have been developed.
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Synonyms and analogies of "microprocessing" in English