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generation form factor
Examples with "generation form factor" and their translation in Chinees
The new line of M. next generation form factor (NGFF) connectors are smaller in both size and volume.
2013年5月22日 适用于最新设备的板连接器 新型 M. 下一代外形 （NGFF） 连接器系列的尺寸和体积都更小。
Unveiled new All-Flash 1PB in 1U server and JBOF with the new generation form factor flash storage
揭开新一代全闪存在1U 1PB服务器和JBOF的新一代闪存存储规格
TE M. Next Generation Form Factor makes the transition to smaller form factor in both size and volume.
TE M. 下一代外形产品线在尺寸和体积上自然过渡到更小外形。
Andere resultaten
Scalable Fixed Form-Factor Switches for Next-Generation IP Networks
面向下一代IP网络的可扩展固定尺寸交换机
The QFSP form factor is the second generation industry standard for pluggable 40Gbps optical transceivers.
QFSP 小封装是可插拔 40Gbps 光纤收发器的第二代行业标准。
Fairchild Semiconductor's Generation II XS DrMOS series provides industry-leading technology to meet the energy efficiency and form factor challenges encountered in today's designs.
飞兆半导体Generation II XS DrMOS系列器件提供业界领先技术，以应对现今电子设计所遇到的能效和外形尺寸挑战。
The small form factor and ultra-low- power radar module provides precise motion detection data which can be translated into optimized functionalities and features of next-generation smart and Internet of Things (IoT) devices.
小巧的外形和超低功耗 的 雷达模块可提供精确的运动检测数据，这意味着 为 新一代智能和物联网（ IoT ）设备带来功能和特性 上的 优化。
OSFP products offer high port density and can fit up to 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps.
OSFP 产品提供高端口密度，可搭载多达 36 个 1RU 开关外形规格的 8 通道接口端口，符合当前及下一代硅产品路线图。
Fiber array is assembled with MPO, used fornext generation pluggable modules which requires ultra-small form factor
MPO插芯PIN针散件适配器跳线Fiber Array诚聘英才激励体质
SSDs are designed to be the next generation of mass market data storage, and therefore have the same form factor and utilise the same SATA connections as current generation HDDs. Close
固态硬盘专为新一代大众市场数据存储而设计，拥有与当前一代机械硬盘相同的外观尺寸，并采用相同的 SATA 接口。 Close
MiniMRP avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.  Small Form Factor DevicesÂ
MiniMRP 航空电子封装是新一代集成电路，通过将封装尺寸减少 40 % ， 以更低的成本实现计算能力的不断增加。
In addition, TE's OSFP products can fit up to 36400G ports into a 1RU switch form factor, aligned with next-generation switch silicon roadmaps. Â
此外，TE 的 OSFP 产品可在 1RU 交换机搭载多达 36 个 400G 端口，符合下一代交换机硅元路线图。
Mobile technology will remain to be a key driver in the electronics industry. The trend towards smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push alternative solutions requiring innovative materials enabling next- generation packages.
移动技术仍将是电子行业的关键驱动因素。趋向于更小的外形因子、提高密度和性能所需的更高I/O计数、以及较低的拥有成本，将推动需要创新材料的替代解决方案，从而实现下一代封装。 在本次网络研讨会中，我们将介绍汉高的各种底部填充解决方案，包括毛细底部填充（CUF）、非导电胶（NCP）和非导电薄膜（NCF）。
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Synoniemen voor generation form factor in het Engels
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