Vertaling van "input data control unit" in Chinees
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输入数据控制单元
The output data buffer 44 operates in the read operation mode, to output the output data signal DOUTZ to the data terminal DQ in response to the output clock signal CLKOZ. An example of the output data buffer 44 is illustrated in FIG. 8. The input data buffer 46 operates in the read operation mode, to output data received at the data terminal DQ to the input data control unit 42 as the input data DINZ.
For example, the column control unit 36, the output data control unit 40, and the input data control unit 42 operate as they receive the internal power supply voltages VIIR and VIIC. The memory cell array 38 is not denoted by a thin solid line because it does not directly receive the power supply voltage VDD or the internal power supply voltage VIIR or VIIC.
Subsequently, the start-up signal CONX is deactivated in response to the deactivation of the short-circuit signal SWONX, to turn off the pMOS transistor P3 ((k) of FIG. 17). The internal power supply voltage VIIC decreases gradually ((l) of FIG. 17). Then, operations of the column control unit 36B, the output data control unit 40, and the input data control unit 42 which are supplied with the internal power supply voltage VIIC are stopped.
The input data control unit 42 operates as it receives the internal power supply voltages VIIR and VIIC. The input data control unit 42 outputs an input data signal DINZ received from the input data buffer 46 to the common data line CDBZ. An example of the input data control unit 42 is illustrated in FIG. 7.
The input data control unit 42 has a write clock buffer WCLKB, an input data latch circuit IDLT, and a write data bus switch WDBSW. FIG. 7 illustrates the input data control unit 42 corresponding to one data terminal DQ (DINZ). The write clock buffer WCLKB generates a write clock signal WCLKZ in synchronization with the clock signal CLKZ when the write signal WRZ is activated at the high level. For example, the write clock signal WCLKZ is activated the number of clock cycles corresponding to a burst length.
For example, the column voltage generation unit 30 is designed such that the internal power supply voltage VIIC may reach the same first voltage V1 as the internal power supply voltage VIIR before the command control unit 16 receives the write command WR or the read command RD. The time T1 is determined by the load capacity of the internal power supply line VIIC and the voltage generation capacity of the column voltage generation unit 30. The internal power supply line VIIC is connected to the column control unit 36, the output data control unit 40, and the input data control unit 42 and has a load capacity smaller than the internal power supply line VIIR. Accordingly, the time T1 is reduced easily. In such a manner, the scale of the circuit supplied with the internal power supply voltage VIIC is determined to satisfy the time T1.
A period in which the internal power supply voltage VIIC is dissipated owing to the operations of the column control unit 36, the output data control unit 40, and the input data control unit 42 covers a time when the write command WR or the read command RD is received to a time when the write or read operations are completed respectively. By stopping the generation of the internal power supply voltage VIIC in a period when none of the column control unit 36, the output data control unit 40, and the input data control unit 42 operates, the dissipation power of the semiconductor memory MEM is reduced.
If the delay time tDLY is long such that the switch 32 may be turned on after the write command WR or the read command RD is accepted by the command control unit 16, a deficiency may occur in capacity of supplying power to the column control unit 36, the output data control unit 40, and the input data control unit 42 ((f) of FIG. 10). In this case, the internal power supply voltage VIIC drops. Moreover, after the switch 32 is turned on, the internal power supply voltage VIIR drops due to charge sharing. A drop in internal power supply voltage VIIR may affect the operations of the column control unit 36, the output data control unit 40, and the input data control unit 42. For example, the timing at which the input data latch circuit IDLT in the input data control unit 42 illustrated in FIG. 7 latches the input data signal DINZ may possibly shift. Therefore, it is desirable that the switch 32 may be turned on before the column control unit 36, the output data control unit 40, and the input data control unit 42 start to operate, that is, before the write command WR or the read command RD is accepted.
As hereinabove described, the present embodiment provides almost the same effects as those by the earlier described embodiments. Moreover, the switch 32 is turned on after the internal power supply voltage VIIC rises to the first voltage V1 and before the column control unit 36, the output data control unit 40, and the input data control unit 42 start to operate. It is thus possible to prevent fluctuations in internal power supply voltage VIIC, thereby preventing a shift in timing at which the row control unit 34 activates the word line signal WLZ and the sense-amplifier control signal SAEZ. Further, when the switch 32 is turned on, the internal power supply voltage VIIR is supplied to the internal power supply line VIIC, thereby enabling stabilizing the internal power supply voltage VIIC. It is thus possible to prevent a shift in timing at which the input data latch circuit IDLT in the input data control unit 42 latches the input data signal DINZ. That is, it is possible to prevent operations of the column control unit 36, the output data control unit 40, and the input data control unit 42 from being affected.
The semiconductor memory MEM sequentially receives the write command WR as well as the number of write data pieces WD1, WD2, WD3, and WD4 that corresponds to the burst length, thereby performing write operations ((g) of FIG. 10). When having received the read command RD, the semiconductor memory MEM performs read operations to sequentially output read data pieces RD1, RD2, RD3, and RD4 after the number of clock cycles that corresponds to the latency CASL (CASL=3 in FIG. 10) elapse ((h) of FIG. 10). In the write and read operations, the semiconductor memory MEM starts operating the column control unit 36, the output data control unit 40, and the input data control unit 42 supplied with the internal power supply voltage VIIC after the time tRCD elapses.
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