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memory module sockets
Examples with "memory module sockets" and their translation in Chinees
Locate the memory module sockets on the system board.
找到系统主板上的内存模块插座。
TE provides a wide range of reliable dual in-line memory module sockets designed to JEDEC industry standards including: DDR, DDR2, DDR3, DDR4, fully buffered (FB), mini, and SO DIMM.
DIMM 插槽 TE 提供多种符合 JEDEC 行业标准的可靠双列直插式存储器模块插槽，包括：DDR、DDR2、DDR3、DDR4、全缓冲 （FB ） 、 小型和 SO DIMM。
DDR2 memory module sockets from FCI accept industry-standard FB-DIMM, DIMM or SO-DIMM assemblies. The sockets allow convenient memory expansion in servers, workstations, desktop PCs, mobile PCs and embedded applications in communications and industrial equipment.
FCI 的 DDR2 内存模块插槽可接受行业标准的 FB-DIMM、DIMM 或 SO-DIMM 组件。该插槽允许在服务器、工作站、台式计算机、笔记本以及通信与工业设备的嵌入式应用中方便地扩展内存。
Andere resultaten
As seen in Figure 1, the performance of the memory subsystem increases almost linearly from the slowest configuration, a single memory channel populated on either Xeon processor memory controller by a single 8 Gigabytes (GB) DDR3 1600 MHz memory module; to the fastest, using a quad channel (also known as 1 DIMM per channel (DPC) populated memory subsystem with four 8GB 1600MHz memory modules populating each memory socket in the first available memory bank of either processor. Even with the increased electrical load of a quad-channel configuration (1 DPC), a near four-fold increase in memory subsystem performance to ~70GB/s compared to a single channel configuration is observed, an ideal solution for applications requiring high performance for resource intensive applications such as IMDB.
如图1所示，内存子系统的性能几乎以线性方式从最低配置开始增加：在单个Xeon处理器环境下，单条8GB DDR3 1600 MHz内存模组的速度最慢。 而速度最快的组合则是在第一个Bank的四条插槽里插满8GB 1600MHz内存，这样就能够发挥四通道的高性能。 虽然四通道配置（1 DPC）的功耗有所增加，但性能也会相应地增加到将近四倍（与单通道时相比 ） ， 达到 70GB/s左右。
TE DIMM sockets provide interconnection to memory modules for consumer devices applications.
TE DIMM 插槽为消费类设备应用的内存模块提供互连。
TE memory sockets enable reliable interconnection to memory modules for PCs, servers, mass storage, and communication memory applications. Product Group
TE 内存插槽为 PC、服务器、大容量存储和通信内存应用实现了与内存模块的可靠互连。 产品组
TE DDR3 memory sockets enable reliable interconnection to memory modules where peak performance is required.
DDR3 内存插槽提供了与内存模块的可靠互连，以达到所需的最佳性能。
Reinsert the memory module(s) with the largest capacity in the first socket followed by the smaller capacities in descending order.
重新插入内存模组，使最大容量的模组位于第一个插槽，然后按顺序依次插入容量较小的模组。
Press the memory into the socket until the tabs snap into place and secure the memory module.
5） 将内存插入插槽中，直到卡扣卡到正确位置，并固定内存模组。
To ensure the memory modules are installed properly, line up the memory notches with the key in the memory socket, then push the memory firmly into the socket until the tabs lock the memory into place.
为了确保正确安装内存模组，请将内存凹口与内存插槽中的凸口对齐，然后将内存牢固地推入到插槽中，直至卡扣将内存锁定就位。
To reseat a memory DIMM, press down and out on the ejectors on each end of the socket until the memory module pops out of the socket.
要重新拔插内存DIMM，请向下用力按插槽两端的弹出装置，直到内存模块从插槽中弹出。
LRDIMMs are similar to Registered DIMMs that are used in the vast majority of servers today. They are built on a memory module Printed Circuit Board that fits the same server memory sockets and use the same type of DRAM chips.
LRDIMM 与当今大多数服务器中使用的寄存型 DIMM 相似，均建立在适用于相同服务器内存插槽的内存模组印刷电路板之上，并使用相同类型的 DRAM 芯片。
Remove all memory modules except for DIMM 1 and DIMM 2 by pressing down and out on the ejector on each end of the socket until the memory module pops out of the socket.
通过向下并向外按插槽两端的弹出装置，将内存模块从插槽中弹出，以卸下除DIMM 1和DIMM 2之外的所有内存模块。
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