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module card interface
Vertaling van "module card interface" in Chinees
模块卡接口
This white paper discusses the next generation module card interface, designed for smaller, lighter, and thinner computing devices.
此白皮书探讨的是专为更小、更轻、更薄的计算设备设计的下一代模块卡接口。
This white paper discusses the next generation module card interface, designed for smaller, lighter, and thinner computing devices. Antennas and RF Our standard and custom stamped antennas are used across the leading Wi-Fi enabled TV and set top box (STB) products offering expansive bandwidth and low profile solutions.
此白皮书探讨的是专为更小、更轻、更薄的计算设备设计的下一代模块卡接口。 天线和射频 我们的标准和定制冲压天线广泛用于启用领先 Wi-Fi 的电视和机顶盒 （STB） 产品，提供广泛带宽和低外形解决方案。
This white paper discusses the next generation module card interface, designed for smaller, lighter, and thinner computing devices. FPC and FFC
此白皮书探讨的是专为更小、更轻、更薄的计算设备设计的下一代模块卡接口。 FPC 和 FFC
This white paper discusses the next generation module card interface, designed for smaller, lighter, and thinner computing devices. Antennas and RF TE provides local design and prototyping centers across the globe, and world class manufacturing of all radio frequency (RF) and antenna technologies, including FPC, MID, LDS, printed, stamped, and tunable solutions, plus supporting test switches and RF cables.
此白皮书探讨的是专为更小、更轻、更薄的计算设备设计的下一代模块卡接口。 天线和射频 TE 提供遍布全球的本地设计和原型设计中心，以及所有射频 （RF） 和天线技术（包括 FPC、MID、LDS、印刷、冲压和可调解决方案，以及支持测试开关和射频电缆）的一流制造工艺。
This white paper discusses the next generation module card interface, designed for smaller, lighter, and thinner computing devices. Antennas and RF Our broad PC antenna experience and MetaSpan antenna technology provide low cost, slim profile, low specific absorption rate solutions for the latest PC, notebook, and ultraportable device designs.
此白皮书探讨的是专为更小、更轻、更薄的计算设备设计的下一代模块卡接口。 天线和射频 我们的丰富 PC 天线经验和 MetaSpan 天线技术可为最新的 PC、笔记本电脑和超便携设备设计提供成本低廉、外形纤细、比吸收率低的解决方案。
TE's anti-buckling micro SIM card solution for smartphones is low in height, but high in strength and versatility. White Paper Next Generation Module Card Interface
TE 适用于智能手机的防屈曲微型 SIM 卡解决方案具有高度低、强度高和功能多的特点。 白皮书 下一代模块卡接口
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