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surface mounted semiconductor device
Examples with "surface mounted semiconductor device" and their translation in Chinees
mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件的机械标准化.第6部分：表面安装半导体器件封装外形图绘制的一般规则
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Wakefield Engineering is recognized as a worldwide leader in innovative thermal management solutions. Their products range from board level heat sinks for both surface mount and thru-hole, to fan mounted heat sinks for microprocessors and CPUs. Wakefield Engineering offers a single source for all of your thermal requirements. DeltaPads are replacements to heat sink grease but without any mess. They are heat conducting, electrically isolating pads to go between the heat sink and your semiconductor device. TO-220 heatsinks will also fit TO-202 and TO-126 packages.
Wakefield Engineering 被公认为是创新散热方案方面的世界领先者。他们产品涉及范围涵盖表面贴装和透孔的板面散热片，到微处理器和 CPU 风扇上的散热片。Wakefield Engineering 提供一个可以满足您所有散热产品需求的单一货源。DeltaPads 可用来代替散热膏而不产生任何污染。这些衬垫导热不导电，位于散热片和半导体设备之间。TO-220 散热片也适合于 TO-202 和 TO-126 封装。
The capacity of semiconductor devices may vary due to manufacturing variations.
半导体设备的实际耐量可能由于制造过程中的偏差而发生变化。
All external lighting distribution boards & devices are surface mounted.
所有外部照明设备的配电箱和设备均应安装在地面。
Do not cut or bend the metal frame of a non-insulated semiconductor device.
请勿对非绝缘型半导体器件的金属框架进行切割或弯折。
Semiconductor devices can perform a variety of control functions in electronic equipment.
半导体器件在电子设备中能起各式各样的控制作用。
Surface mounted units can also be held in place by the piping.
表面安装的设备也可通过管道固定到位。
There are many architectures requiring different kinds of semiconductor devices.
有许多架构需要不同种类的半导体器件。
It is the back-end manufacturing process for finished semiconductor devices.
它是成品半导体器件的后端制造工艺。
Diodes, transistors, and thyristors are all types of semiconductor devices.
二极管、晶体管和晶闸管全都属于半导体设备。
Damage to the semiconductor device is caused directly by energy exchange.
直接通过能量交换引起半导体器件的损坏。
Surface mounted against walls, concrete and steel structures etc.
表面应靠在墙、混凝土和钢制结构等上安装。
Do not transfer semiconductor devices in damp-proof packing.
请不要对防潮包装的半导体设备进行转移。
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