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A laser processing device in which variation in the direction of laser light emission in each laser head can be corrected.
レーザヘッド毎のレーザ光の出射方向のばらつきを補正することができるレーザ加工装置を提供する。
The purpose of the present invention is to obtain a laser processing device and a laser processing method that can expand the range of processing hole diameter and the range of energy density.
The purpose of the present invention is to obtain a laser processing device and a laser processing method, which are capable of cutting an object to be processed with a thickness using a laser having a short wavelength.
A laser processing device is equipped with a laser oscillator, a cooler that cools the laser oscillator, and a control unit that controls the laser oscillator and the cooler.
A fiber laser processing device (51) comprises: an air purge unit unit (20) having a dew point minimizing unit (23) which makes pressurized air for purging which is supplied from without into low dew point dry air by gas permeation membrane modules (23a, 23b); a fiber laser oscillator (1) further comprising a plurality of fiber laser modules (2) which output laser beams, a combiner (3) which combines the laser beams which are outputted from each of the plurality of fiber laser modules (2) and emits same therewithout, and a distributor (5) which supplies by distribution the low dew point dry air to each of the plurality of fiber laser modules (2); and a laser processing apparatus (10) which carries out a laser process on a workpiece (W) with the laser beam which is emitted from the combiner (3).
A shutter unit capable of preventing the scattering of a laser beam when the light path of a laser beam is blocked and being downsized, and a laser processing device using it.
The laser processing device can not only make the plate-shaped workpiece processing table and the rod-shaped workpiece processing table move to and retreat from the processing area, the device can also easily perform switching work.
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