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stackup
/'stækʌp/
Definizione
1. comparison of different items 2. diagram showing accumulated... Vedere più
叠层
比较
对比
层叠
This dialog allows you to design your own stackup, or you can use a template in the "Presets" dropdown menu.
此对话框可供您设计自己的叠层,或者您可以在"预设"下拉菜单中使用模板。
No matter what type of PCB you are wanting to manufacture - be it rigid, or rigid-flex - the first thing to do is to define the layer stackup as required.
无论您想制造哪一种PCB(刚性或刚柔结合 ) , 首先要做的是根据需要确定叠层。
With the circuit schematic design and the high speed PCB design, completes PCB composition, stackup design, internal layer design, system grounding design and high-speed signal line design.
在电路原理图设计中遵循高速信号电路PCB设计原则,完成了系统PCB的布局、叠层设计、内电层设计、系统接地设计和高速信号线等设计;
Tools for board planning let you layout and organize multiple stackup regions, including details such as bending line placement and radius. Learn More about Board Planning Mode
电路板规划工具能够帮助您安排多个叠层区域,包括诸如折叠线放置和半径等细节。 关于Board Planning Mode的更多信息
The last step export the final design that has been made intelligent, assigned Material Stackup information for 3D model, Captured Netlist, DRC verified into a.MOD file format.
最 后一步输出已经取得了智能化的最终设计,赋予材料叠层信息的三维模型,捕捉网表,设计规则验证 成.MOD文件格式。
The EPD Design environment has tools to set design Units and Material Stackup Information.
EPD设计环境有工具来设置设计单位和材料叠层 信息。
Countersunk screws may be of different length due to shim stackup.
由于垫片叠加布置,埋头螺丝可以是不同长度。
One-piece, rigid cast bracket minimizes shaft deflection and tolerance stackup
一体式,刚性铸造支架最小化轴偏转和误差重复
Easy to modify stackup, trace length, trace width, pad size and antipad size
支持修改层叠,走线长度,宽度,焊盘尺寸和大小,反焊盘尺寸和大小等
This suite of modules is built using the main EPD core product for design environment setup, stackup materials, measurement units, building component libraries, and layout tools.
套件模块是使用主EPD核心产品的设计环境设置,层特性设置,计量单位,元件库和布局工具构建的。
An automatic stackup designer dedicated to generating the best possible stackups for quality, manufacturability and...
InStack自动迭板设计功能是专为产生各种可能的最佳质量、可制造的及优异价格的迭构组合的工具...
A typical 6 layered PCB stackup (top) and impossible via arrangement.
典型的6层PCB叠层(顶层)和不可能的过孔布局。
Although the use of blind and buried vias is becoming increasingly common in advanced PCB designs, careful consideration needs to be given to the layer stackup of the PCB to ensure that the board is, in fact, able to be manufactured.
埋孔 :不位于PCB任意侧表面的过孔。 尽管在高级PCB设计中使用盲孔和埋孔越来越常见,但需认真考虑PCB的层叠,确保电路板实际上可以制造。
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