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patterning process
Examples with "patterning process" and their translation in Chinese
With this configuration, processing becomes easy in the case of using lithography in a patterning process, and the voltage value of the voltage pulse for changing the resistance value of the resistance variable element can be lowered.
根据该结构，在图案化工艺中使用光刻法的情况下，加工容易，能够使得使电阻变化型元件的电阻值变化的电压脉冲的电压值较低。
In such a configuration, processing is facilitated when lithography is used in the patterning process, and thereby the voltage value of the voltage pulse which varies the resistance value of the resistance variable element can be lowered.
The structure facilitates manufacture of the variable resistance element using photolithography as a patterning process, thereby reducing a voltage value of a voltage pulse varying a resistance value of the variable resistance element.
通过该结构，在图案形成过程中使用光刻的情况下，容易加工，能够降低使电阻变化元件的电阻值变化的电压脉冲的电压值。
Although the wiring pattern connected to the TFT device in the display area generally exists around the IC chip mounted area, when the formed pattern of the wiring pattern layout and the stress absorption region 6 are arranged suitably so as not be irradiated by the laser beam, the stress absorption regions 6 can be formed either after the wiring patterning process or after the IC chip mounting process without causing any problem.
We produce sacrificial layers in the lithographic patterning process, various dielectric materials and enabling hardmasks. Our silicon based anti-reflective coatings under photoresists facilitate patterning with KrF and ArF laser excimers (248 and 193nm). Our manufacturing excellence enables even sub 5ppb total trace metals which is a prerequisite for sub-10nm nodes.
Other results
NILT works with several LED companies and has great experience in making wafer sized NIL stamps or molds with sub-wavelenght dot patterns or photonic bandgap structures (PBG), used directly in a NIL process for patterning of LEDs or used as masters for making polymer NIL stamps. MICRO FLUIDICS
NILT与多家LED公司合作用纳米压印技术造出一般晶圆大小的模板，上面图形印有亚波长SUB-WAVELENGTH圆点图形或光子带隙结构PHOTONIC BANDGAP STRUCTURES，用作母模复制聚合物NIL工模，或直接印制图形化蓝宝石衬底PSS。 微流控 （MICRO FLUIDICS）
It controls our genetic patterning, our physical body, our predisposition to certain health conditions, our aging process, our metabolism and much more.
The booster antenna in SmartFacing is manufactured using a dry process with the use of laser patterning and paper as the substrate.
Processing Lithography Lithography, patterning of the wafers, is a critical step in the semiconductor process.
The manufacturing of TFT/LED technologies and storage media is structured in wafer cleaning and metallization steps, patterning and etching, mapped in typical applications such as process cooling water, neutralization and chemical distribution.
For a wide variety of applications, e.g. those requiring finer resolution, the preferred process comprises screen printing a paste which further comprises a photoinitiator and a photohardenable monomer, photo-patterning the dried paste and firing the resulting patterned paste.
Likewise, a transparent conductive film made of ITO or the like is formed on the transparent substrate 37 configured of a glass substrate or a plastic film substrate Next, a resist layer is formed on an entire surface of the transparent conductive film, and then an electrode pattern is formed on the resist layer by patterning Then, the upper electrode 36 is formed by exposure and development, and the resist layer is removed Next, after an entire surface of the upper electrode 36 is coated with the alignment film 35, the alignment film 35 is dried and fired After that, a rubbing process is performed on the alignment film 35 Therefore, the alignment film 35 functions as an alignment film for horizontal alignment, and a pretilt is allowed to be formed in a rubbing direction of the alignment film 35
Subsequently, any deposit on the back side of the substrate due to the CVD growth process may be removed using plasma etch. A normal manufacturing process may also include patterning and etching of the emitter region or mesa 236, patterning and etching of the base region or mesa 234, and forming the junction termination region 260 at the periphery of the base mesa 234, such as illustrated in Figure 2. Outline of the base mesa 234 may advantageously have sufficiently rounded edges to prevent electric field concentration at its periphery. The junction termination region 260 is intended to prevent the device from electric field concentration at the periphery, thereby preventing early breakdown. The junction termination region 260 may be formed by a number of techniques, such as for example the junction termination extension technique. Further, a ring with an accurately controlled acceptor dose may be formed at the periphery of the base mesa 234 by implantation of boron or aluminum ions into the device periphery, the acceptor dose corresponding to full depletion of the implanted region at approximately 50 to 70% of the theoretical breakdown voltage. The dose may advantageously be in the range of approximately 0.9x1013 to 1.2x1013 cm-2 for electrically active acceptors in the JTE region.
随后，可利用等离子刻蚀消除CVD生长过程中在衬底的背面产生的任何沉积物。正常制造过程还可包括：对发射极区域或台面236进行图案形成和腐蚀；对基极区域或台面234进行图案形成和腐蚀；在基极台面234的外围形成结终端区域260，如图2所示。有利地，基极台面234的轮廓可具有足够圆的边缘，以防止其外围产生电场集中。所述结终端区域260用于防止装置外围产生电场集中，从而防止早期故障。所述结终端区域260可通过多种技术形成，例如，结终端延伸技术。进一步，可通过在装置外围植入硼或铝离子而在基极台面234的外围形成具有精确控制的受主剂量的环，受主剂量与理论击穿电压的约50至70%下植入区域的全耗尽剂量对应。有利地，对于JTE区域中的有源受主，所述剂量的范围可约为0.9x1013至1.2x1013 cm-2。
Synonyms and analogies of "patterning process" in English
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