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Thus, excellent bonding between the high distortion point glass substrate (1) and the semiconductor device (20) can be provided, and at the same time, since the recessed alignment mark (8) is not sealed, the bonding state can be maintained even when the high distortion point glass substrate (1) is exposed under the high temperature condition after bonding the semiconductor device (20).
Specifically, in the semiconductor manufacture, a recessed alignment mark (8) is formed on a front plane of a high distortion point glass substrate (1) as a target for alignment for bonding, and the recessed alignment mark (8) is permitted to have a shape which extends to an external side of the semiconductor device (20).
Please note: Setting the time without turning the dial back more than one-half revolution may cause the watch to loose time.Step 3 Slowly continue rotating the minute hand back until it reaches the orange time alignment mark on the edge of the core module.
Provided is a silicon carbide semiconductor device for which the number of masks for fabrication can be reduced and the accuracy of alignment mark detection can be improved while suppressing the lowering of the voltage resistance in a back-end region.
The control unit finishes the movement of the application unit until the predetermined gap directly downstream from the area where the alignment mark is detected by the detection unit passes the application unit.
The circuit member connecting adhesive has excellent reliability in connection between a semiconductor chip and a substrate, and improves recognition performance of an alignment mark to be used for alignment of a semiconductor chip with a substrate to a level sufficient for practical use.
A light-emitting module according to an embodiment has a feed pattern that is formed on a substrate surface and powers a light-emitting element, and an alignment mark formed integrally with the feed pattern.
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